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  • Auto Insertion Technology

  • Auto Insertion Technology
  • Surface Mount Technology
  • Mixed Technology(SMT and Through Hole)
  • Ball Grid Array (BGA) Assembly
  • In-Circuit Test
  • Functional Circuit Test
  • Wave Solder
  • Solder Touch-up
  • Box Build
  • Fixture and Pallet Design as needed
  • Outsource Operation as needed: PCB,
       Metal box, Plastic, etc.



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    Last Update : 12 July 2006
    ©Copyright 2003 C. Y. Tech Co., Ltd. All rights reserved.